Low Warpage Coreless Substrate for IC Packages
نویسندگان
چکیده
منابع مشابه
Low Warpage Coreless Substrate for IC Packages
Coreless substrate is excellent for fine patterning, small via pitches, and transmission property, and it is a promising IC packaging method for the next generation. Warpage of coreless substrate is generally large compared to the other types of IC packaging substrates because of inadequate rigidity, so the most important problem for the application of coreless substrates for high-end BGAs is w...
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ژورنال
عنوان ژورنال: Transactions of The Japan Institute of Electronics Packaging
سال: 2012
ISSN: 1883-3365,1884-8028
DOI: 10.5104/jiepeng.5.55